12 Layer 3OZ High Density Interconnect HDI PCB
♦ What is High Density PCB (HDI PCB)?
A High Density Interconnect (HDI) PCB is an advanced printed circuit board designed to accommodate more components in a smaller space by using finer traces, smaller vias, and higher connection density than traditional PCBs. HDI technology enables miniaturization, improved signal integrity, and enhanced performance in modern electronics.
♦ Key Features of HDI PCBs:
✅ Finer Trace Width/Spacing (≤ 100µm, vs. standard 150µm+).
✅ Microvias (laser-drilled, < 150µm diameter) for high-density interconnects.
✅ Blind & Buried Vias (instead of through-hole vias) to save space.
✅ Thinner Dielectric Materials (for compact layer stacking).
✅ Higher Layer Count (often 8+ layers in a slim profile).
✅ Advanced Materials (low-loss dielectrics for high-speed signals).
♦ HDI PCB vs. Standard PCB: Key Differences?
| Feature | HDI PCB | Standard PCB |
| Trace Width | ≤ 100µm (can go down to 40µm) | ≥ 150µm |
| Via Size | Microvias (50–150µm) | Through-hole vias (≥ 300µm) |
| Via Types | Blind, buried, stacked | Mostly through-hole |
| Layer Count | 8+ (with thin dielectrics) | Typically 2–12 layers |
| Signal Speed | Optimized for high-speed signals | Limited high-speed performance |
| Applications | Smartphones, wearables, aerospace | Consumer electronics, power circuits |
♦ Types of HDI PCBs:
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- 1+N+1 – Single HDI layer (microvias on outer layers).
- 2+N+2 – Two HDI layers (stacked microvias).
- 3+N+3 – Three or more HDI layers (ultra-high density, used in advanced chips).
- Any-Layer HDI – Microvias can be placed anywhere (used in smartphones like iPhones).
♦ Technical Parameters
| Item | Spec |
| Layers | 1~64 |
| Board Thickness | 0.1mm-10 mm |
| Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
| Max Panel Size | 800mm×1200mm |
| Min Hole Size | 0.075mm |
| Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
| Board Outline Tolerance | 士0.10mm |
| Insulation Layer Thickness | 0.075mm--5.00mm |
| Out Layer Copper Thickness | 18um--350um |
| Drilling Hole (Mechanical) | 17um--175um |
| Finish Hole (Mechanical) | 17um--175um |
| Diameter Tolerance (Mechanical) | 0.05mm |
| Registration (Mechanical) | 0.075mm |
| Aspect Ratio | 17:01 |
| Solder Mask Type | LPI |
| SMT Min. Solder Mask Width | 0.075mm |
| Min. Solder Mask Clearance | 0.05mm |
| Plug Hole Diameter | 0.25mm--0.60mm |
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High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones Images
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