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One Stop SMT PCB Assembly Board Fab Service For Consumer Electronics

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One Stop SMT PCB Assembly Board Fab Service For Consumer Electronics

MOQ : 1

Price : Contact us

Payment Terms : T/T

Supply Ability : 200,000 + SQM/month

Layer : 4 Layer

Board Thickness : 0.8m

Board Material : FR4

Finished Copper : 0.5 OZ

Min Line Width/Spacing : 0.1/0.1mm

Surface Finish : HASL

Application : Electronic Products

Certificate : UL,IATF16949,ISO&Reach

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One-Stop SMT PCB Manufacturing for Consumer Electronics

♦ What is SMT PCB Manufacturing?

SMT (Surface Mount Technology) PCB Manufacturing is the process of assembling printed circuit boards by mounting electronic components directly onto the surface of the PCB using automated machines, as opposed to through-hole technology (THT), where components are inserted into drilled holes.

One Stop SMT PCB Assembly Board Fab Service For Consumer Electronics

♦ Key Steps in SMT PCB Manufacturing

1. PCB Fabrication (Before SMT Assembly)

- The bare PCB is manufactured with solder pads (no holes needed for SMT components).
- Common materials: FR-4, aluminum, or flexible substrates.

2. Solder Paste Application

- Stencil Printing: A metal stencil aligns with the PCB, and solder paste (a mix of tiny metal balls and flux) is applied to the pads.

3. Component Placement

- Pick-and-Place Machines automatically pick SMDs (Surface Mount Devices) from reels/trays and place them on the solder paste with high precision.
- Components include resistors, capacitors, ICs (QFN, BGA), and more.

4. Reflow Soldering

- The PCB passes through a reflow oven, where controlled heating melts the solder paste, forming permanent electrical connections.
- Temperature profile: Preheat → Soak → Reflow → Cooling.

5. Inspection & Testing

- AOI (Automated Optical Inspection) – Checks for misalignment, solder defects.
- X-Ray Inspection – For hidden joints (e.g., BGA components).
- Functional Testing – Validates the assembled PCB’s performance.

♦ SMT vs. Through-Hole (THT) PCB Assembly

Feature	SMT PCB Assembly	Through-Hole (THT) Assembly
Component Size	✅ Tiny (0201, 0402)	❌ Larger (leaded parts)
Speed	✅ Faster (automated)	❌ Slower (manual/semi-auto)
Cost	✅ Lower (mass production)	❌ Higher (labor-intensive)
PCB Space	✅ High-density	❌ Requires more space
Strength	⚠️ Less mechanical strength	✅ Better for high-stress environments

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

Product Tags:

SMT pcb assembly board

Fab pcb assembly board

SMT pcb fab service